Intel Leads the Dual-SIM Market with its XMM 2138 Platform

February 15, 2011 by | Comments

Intel Mobile Communications introduced the XMM™ 2138 platform supporting Dual-SIM Dual-Standby (DSDS) operation. The XMM 2138 Dual-SIM platform is based on the popular and very successful X-GOLD 213 EDGE baseband chip, the lowest-cost EDGE single-chip solution for mobile Internet (browsing & messaging).

Highest integration of GSM baseband, RF transceiver, mixed signal, power management, SRAM and FM radio in 65nm CMOS technology and the innovative 8×8 mm eWLB-217 lead-free package of the X-GOLD 213 enable very small and slim, but feature rich designs. The XMM 2138 EDGE platform paves the way for mobile phone manufacturers to provide optimized and cost-effective solutions with short time-to-market for the increasing demand of the emerging Dual-SIM market.

 

Dual-SIM phones can natively work with two SIM cards, both of which may be active at the same time. While most of these active Dual-SIM phones have two transceivers, the new DSDS generation provides the ability to have two active SIM simultaneously using only one transceiver, with related cost savings. A DSDS mobile enables the functionality of two mobiles in one device whether for separating business and private operation or when roaming. Just one convenient and compact handset offers the advantage of different calling plans from service providers to save costs, while frequent travelers benefit from the greater coverage.

Today, a high growth rate for Dual-SIM phones exists in the BRICA (Brazil, Russia, India, China, and Africa) region and most significantly in the Asian-Pacific countries. The market research group Strategy Analytics forecasts that 206 million DSDS handsets will be sold worldwide in 2014, compared with 41 million in 2010. In some regions, India for instance, the Dual-SIM phone segment is estimated to be the fastest-growing market segment for mobile phones.

–(Intel Press Room)–

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